Author Publications

2003

Nguyen, Viet H. and Daamen, Roel and Kranenburg van, Herma and Velden van der, Peter and Woerlee, Pierre H. (2003) A Physical Model for Dishing during Metal CMP. Journal of the Electrochemical Society, 150 (11). G689-G693. ISSN 0013-4651

2001

Nguyen, V.H. and Hof, A.J. and Kranenburg van, H. and Woerlee, P.H. and Weimar, F. (2001) Copper chemical mechanical polishing using a slurry-free technique. Microelectronic Engineering, 55 (1-4). pp. 305-312. ISSN 0167-9317

2000

Nguyen, V. and Kranenburg van, H. and Woerlee, P. (2000) Dependency of dishing on polish time and slurry chemistry in Cu CMP. Microelectronic Engineering, 50 (1-4). pp. 403-410. ISSN 0167-9317

Nguyen, Viet H. and Velden van der, Peter and Daamen, Roel and Kranenburg van, Herma and Woerlee, Pierre H. (2000) Modelling of dishing for metal chemical mechanical polishing. In: International Electron Devices Meeting, 2000. IEDM Technical Digest, December 11 to 13, 2000, San Francisco, USA.

1999

Nguyen Hoang, V. and Timmer, B. and Kranenburg van, H. and Woerlee, P.H. (1999) Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing. In: 29th European Solid-State Device Research Conference, ESSDERC, September 13-15, 1999, Leuven, Belgium.