Author Publications

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Jump to: 2003 | 2001 | 2000 | 1999
Number of items: 5.

2003

Nguyen, Viet H. and Daamen, Roel and Kranenburg, Herma van and Velden, Peter van der and Woerlee, Pierre H. (2003) A Physical Model for Dishing during Metal CMP. Journal of the Electrochemical Society, 150 (11). G689-G693. ISSN 0013-4651

2001

Nguyen, V.H. and Hof, A.J. and Kranenburg, H. van and Woerlee, P.H. and Weimar, F. (2001) Copper chemical mechanical polishing using a slurry-free technique. Microelectronic Engineering, 55 (1-4). pp. 305-312. ISSN 0167-9317

2000

Nguyen, V. and Kranenburg, H. van and Woerlee, P. (2000) Dependency of dishing on polish time and slurry chemistry in Cu CMP. Microelectronic Engineering, 50 (1-4). pp. 403-410. ISSN 0167-9317

Nguyen, Viet H. and Velden, Peter van der and Daamen, Roel and Kranenburg, Herma van and Woerlee, Pierre H. (2000) Modelling of dishing for metal chemical mechanical polishing. In: International Electron Devices Meeting, 2000. IEDM Technical Digest, December 11 to 13, 2000, San Francisco, USA (pp. pp. 499-502).

1999

Nguyen Hoang, V. and Timmer, B. and Kranenburg, H. van and Woerlee, P.H. (1999) Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing. In: 29th European Solid-State Device Research Conference, ESSDERC, September 13-15, 1999, Leuven, Belgium (pp. pp. 260-263).

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