Author Publications

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Jump to: 2010 | 2004 | 2003 | 2002 | 2001
Number of items: 9.

2010

Nguyen, Van Hieu and Salm, Cora (2010) Effect of current crowding on electromigration lifetime investigated by simulation and experiment. Computational Materials Science, 49 (4). pp. 235-238. ISSN 0927-0256

2004

Nguyen, H.V. and Salm, C. and Krabbenborg, B. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 April 2004, Phoenix, Arizona, USA (pp. pp. 619-620).

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. Ton and Kuper, Fred G. (2004) Fast Thermal Cycling-Enhanced Electromigration in Power Metallization. IEEE Transactions on Device and Materials Reliability, 4 (2). pp. 246-255. ISSN 1530-4388

Nguyen, Hieu V. (2004) Multilevel interconnect reliability on the effects of electro-thermomechanical stresses. thesis.

2003

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) Electrothermomigration-induced failure in power IC metallization. In: 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands (pp. pp. 622-630).

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) A reliability model for interlayer dielectrics cracking during very fast thermal cycling. In: Advanced Metallization Conference 2003, September 29 - October 1, 2003 (Tokyo) and 21-23 October 2003 (Montreal), Tokyo, Japan and Montreal, Canada (pp. pp. 295-299).

2002

Nguyen, H.V. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems. In: 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 8-12 July 2002 , Singapore, Thailand (pp. pp. 135-139).

2001

Nguyen, H.V. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2001) Fast thermal cycling stress and degredation in multilayer interconnects. In: 4th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE, 28-30 Nov 2001, Veldhoven, The Netherlands (pp. pp. 136-140).

Nguyen, Hieu V. and Salm, Cora and Mouthaan, Ton J. and Kuper, Fred G. (2001) Modeling of the Reservoir Effect on Electromigration Lifetime. In: 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA, July 9-13, 2001, Singapore (pp. pp. 169-173).

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