Author Publications

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Jump to: 2003 | 2001 | 2000 | 1999 | 1998 | 1997 | 1996 | 1995
Number of items: 29.

2003

Tas, N.R. and Gui, C. and Elwenspoek, M. (2003) Static friction in elastic adhesion contacts in MEMS. Journal of Adhesion Science and Technology, 17 (4). pp. 547-561. ISSN 0169-4243

2001

Gui, C. and Oosterbroek, R.E. and Berenschot, J.W. and Schlautmann, S. and Lammerink, T.S.J. and Berg, A. van den and Elwenspoek, M.C. (2001) Selective wafer bonding by surface roughness control. Journal of the Electrochemical Society, 148 (4). G225-G228. ISSN 0013-4651

2000

Nijdam, A.J. and Gardeniers, J.G.E. and Gui, C. and Elwenspoek, M. (2000) Etching pits and dislocations in Si{111}. Sensors and Actuators A: Physical, 86 (3). pp. 238-247. ISSN 0924-4247

Oosterbroek, R.E. and Gui, C. and Berenschot, J.W. and Schlautmann, S. and Lammerink, T.S.J. and Elwenspoek, M.C. and Berg, A. van den (2000) Bonding and etching techniques for precision frabrication of reliable microvalves. In: MicroTAS 2000 Conference, May 14-18, 2000, Enschede, The Netherlands (pp. pp. 179-182).

Pandraud, G. and Koster, T.M. and Gui, C. and Dijkstra, M. and Berg, A. van den and Lambeck, P.V. (2000) Evanescent wave sensing: new features for detection in small volumes. Sensors and Actuators A: Physical, 85 (1-3). pp. 158-162. ISSN 0924-4247

Tas, N.R. and Gui, C. and Elwenspoek, M. (2000) Static friction in elastic adhesive MEMS contacts, models and experiment. In: Thirteenth Annual International Conference on Micro Electro Mechanical Systems, MEMS, January 23-27, 2000, Miyazaki, Japan (pp. pp. 193-198).

1999

Gui, C. and Oosterbroek, R.E. and Berenschot, J.W. and Schlautmann, S. and Lammerink, T.S.J. and Berg, A. van den and Elwenspoek, M.C. (1999) Selective fusion bonding by surface roughness control. In: 1999 Joint international meeting, the 196th Meeting of The Electrochemical Society and 1999 Fall Meeting of The Electrochemical Society of Japan, October 17-22, 1999, Honolulu, Hawai.

Gui, C. and Elwenspoek, M. and Tas, N. and Gardeniers, J.G.E. (1999) The effect of surface roughness on direct wafer bonding. Journal of Applied Physics, 85 (10). pp. 7448-7454. ISSN 0021-8979

Gui, C. and Elwenspoek, M. and Tas, N. and Gardeniers, J.G.E. (1999) The surface adhesion parameter: a measure for wafer bondability. In: Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS , January 17-21, 1999, Orlando, Florida, USA (pp. pp. 290-295).

Gui, C. and Veldhuis, G.J. and Koster, T.M. and Lambeck, P.V. and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M. (1999) Fabrication of nanomechanical optical devices with aligned wafer bonding. Microsystem Technologies, 5 (3). pp. 138-143. ISSN 0946-7076

Veldhuis, G.J. and Nauta, T. and Gui, C. and Berenschot, J.W. and Lambeck, P.V. (1999) Electrostatically actuated mechanooptical waveguide ON-OFF switch showing high extinction at a low actuation-voltage. IEEE Journal of Selected Topics in Quantum Electronics, 5 (1). pp. 60-66. ISSN 1077-260X

1998

Elwenspoek, M.C. and Gui, C. (1998) New developments in wet chemical etching and fusion bonding. In: Microstructures and Microfabricated Systems IV, Electrochemical society 194th meeting (pp. pp. 192-205).

Gui, C. and Elwenspoek, M.C. and Gardeniers, J.G.E. and Lambeck, P.V. (1998) Present and future role of CMP in wafer bonding. In: Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France (pp. pp. 114-126).

Gui, C. and Boer, M. de and Gardeniers, J.G.E. and Jansen, H. and Berenschot, J.W. and Elwenspoek, M. (1998) Fabrication of multi-layer substrates for high aspect ratio single crystalline microstructures. Sensors and Actuators A: Physical, 70 (1-2). pp. 61-66. ISSN 0924-4247

Gui, C. and Elwenspoek, M. and Gardeniers, J.G.E. and Lambeck, P.V. (1998) Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding. Journal of the Electrochemical Society, 145 (6). pp. 2198-2204. ISSN 0013-4651

Gui, C. and Veldhuis, G.J. and Koster, T.M. and Lambeck, P.V. and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M. (1998) Nanomechanical optical devices fabricated with aligned wafer bonding. In: Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS, 1998, Heidelberg, Germany (pp. pp. 482-487).

Gui, Chengqun and Legtenberg, Rob and Tilmans, Harrie A.C. and Fluitman, Jan H.J and Elwenspoek, Miko (1998) Nonlinearity and hysteresis of resonant strain gauges. Journal of Microelectromechanical Systems, 7 (1). pp. 122-127. ISSN 1057-7157

Sanchez, Stefan and Elwenspoek, Miko and Gui, Chengqun and Nivelle, Martin J.M.E. de and Vries, Robert de and Korte, Piet A.J. de and Bruijn, Marcel P. and Wijnbergen, Jan J. and Michalke, Wolfgang and Steinbeiss, Erwin and Heidenblut, Torsten and Schwierzi, Bernard (1998) A high Tc superconductor bolometer on a silicon nitride membrane. Journal of Microelectromechanical Systems, 7 (1). pp. 62-69. ISSN 1057-7157

Veldhuis, G.J. and Gui, C. and Nauta, T. and Koster, T.M. and Berenschot, J.W. and Lambeck, P.V. and Gardeniers, J.G.E. and Elwenspoek, M. (1998) Mechano-optical waveguide on-off intensity modulator. Optics Letters, 23 (19). pp. 1532-1534. ISSN 0146-9592

1997

Gui, C. and Albers, H. and Gardeniers, J.G.E. and Elwenspoek, M. and Lambeck, P.V. (1997) Fusion bonding of rough surfaces with polishing technique for silicon micromaching. Microsystem Technologies, 3 (3). pp. 122-128. ISSN 0946-7076

Gui, C. and Jansen, H.V. and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M. (1997) High aspect ratio single crystalline silicon microstructures fabricated with multi layer substrates. In: International Conference on Solid State Sensors and Actuators, TRANSDUCERS, June 16-19, 1997, Chicago, USA (pp. pp. 633-636).

Gui, C. and Jansen, H.V. and Boer, M. de and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M.C. (1997) High aspect ratio single crystalline silicon microstructures fabricated with multilayer substrates. In: International Conference on Solid-State Sensors and Actuators, TRANSDUCERS, 16-19 June 1997, Chicago, IL, USA (pp. pp. 633-636).

Sanchez, S. and Elwenspoek, M.C. and Gui, C. and Nivelle, M.J.M.E. de and Vries, R. de and Korte, P.A.J. de and Bruijn, M.P. and Schwierzi, B. (1997) A high-Tc superconductor bolometer on a silicon nitridemembrane. In: Tenth Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1997, 26-30 Jan 1997, Nagoya, Japan (pp. pp. 506-571).

Sanchez, S. and Gui, C. and Elwenspoek, M. (1997) Spontaneous direct bonding of thick silicon nitride. Journal of Micromechanics and Microengineering, 7 (3). pp. 111-113. ISSN 0960-1317

Sánchez, S. and Elwenspoek, M.C. and Gui, C. and Nivelle, M.J.M.E. de and Vries, R.J. de and Korte, P.A.J. de and Bruijn, M.P. and Wijnbergen, J.J. and Michalke, W. and Steinbeiss, E. and Heidenblut, T. and Schwierzi, B. (1997) A high-Tc superconductor bolometer on a silicon nitride membrane. In: 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1997, 26-30 Jan 1997, Nagoya, Japan (pp. pp. 506-571).

1996

Gui, C. and Albers, H. and Gardeniers, J.G.E. and Elwenspoek, M.C. and Lambeck, P.V. (1996) Silicon fusion bonding of rough surface with polishing technique. In: Micro System Technologies '96. VDE-Verlag, Berlin, pp. 205-210.

Gui, C. and Albers, H. and Gardeniers, J.G.E. and Elwenspoek, M.C. and Lambeck, P.V. (1996) Silicon fusion bonding with chemical mechanical polishing. In: Proceedings of the 1996 National Sensor Conference. , Delft, pp. 93-97. ISBN 9789040713217

1995

Gui, Chengqun and Legtenberg, Rob and Elwenspoek, Miko and Fluitman, Jan H. (1995) Q-factor dependence of one-port encapsulated polysilicon resonator on reactive sealing pressure. Journal of Micromechanics and Microengineering, 5 (2). pp. 183-185. ISSN 0960-1317

Gui, Chengqun and Legtenberg, Rob and Tilmans, Harrie A.C. and Fluitman, Jan H.J and Elwenspoek, Miko (1995) Nonlinearity and hysteresis of resonant strain gauges. In: Micro Electro Mechanical Systems, MEMS '95, January 29 - February 2, 1995, Amsterdam, the Netherlands (pp. pp. 157-162).

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