Author Publications

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Number of items: 62.

2010

Dijk, K. and Volf, P. and Detcheverry, C. and Yau, A. and Ngan, P. and Liang, Z. and Kuper, F.G. (2010) Validating foundry technologies for extended mission profiles. In: IEEE International Reliability Physics Symposium, IRPS 2010, 2-6 May 2010, Anaheim, CA, USA (pp. pp. 111-116).

Li, Yuan and Donnet, David and Grzegorczyk, Andrzej and Cavelaars, Jan and Kuper, Fred (2010) Assessing the degradation mechanisms and current limitation design rules of SICR-based thin-film resistors in integrated circuits. In: IEEE International Reliability Physics Symposium, IRPS 2010, 2-6 May 2010, Anaheim, CA, USA (pp. pp. 724-730).

2009

Wali, Faisal and Knotter, D. Martin and Mud, Auke and Kuper, Fred G. (2009) Impact of particles in ultra pure water on random yield loss in IC production. Microelectronic Engineering, 86 (2). pp. 140-144. ISSN 0167-9317

2008

Kuper, Fred G. (2008) Automotive IC reliability: Elements of the battle towards zero defects. Microelectronics Reliability, 48 (8-9). pp. 1459-1463. ISSN 0026-2714

Sasse, Guido T. and Acar, Mustafa and Kuper, Fred G. and Schmitz, J. (2008) RF CMOS reliability simulations. Microelectronics Reliability, 48 (8-9). pp. 1581-1585. ISSN 0026-2714

Sasse, Guido T. and Kuper, Fred G. and Schmitz, Jurriaan (2008) MOSFET Degradation Under RF Stress. IEEE Transactions on Electron Devices, 55 (11). pp. 3167-3174. ISSN 0018-9383

Wali, Faisal and Knotter, D. Martin and Kuper, F.G. (2008) Liquid-borne nano particles impact on the random yield during critical processes in IC’s production. In: 11th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2008, 27-28 November 2008, Veldhoven, The Netherlands (pp. pp. 513-515).

Wali, Faisal and Knotter, D.M. and Kuper, F.G. (2008) Impact of nano particles on semiconductor manufacturing. In: Proceedings of 12th IEEE International Multitopic Conference (INMIC) 2008, 23-24 Dec 2008, Karachi (pp. pp. 97-99).

2006

Kuper, F.G. and Fan, X.J. (2006) Reliability practice. In: Mechanics of Microelectronics. Solid Mechanics and Its Applications, 141 . Springer Verlag, London, pp. 35-63. ISBN 9781402049347

Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2006) Current Degradation of a-Si:H/SiN TFTs at Room Temperature and Low Voltages. IEEE Transactions on Electron Devices, 53 (9). pp. 2273-2279. ISSN 0018-9383

Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2006) Determination of the contribution of defect creation and charge trapping to the degradation of a-Si:H/SiN TFTs at room temperature and low voltages. Journal of Non-Crystalline Solids, 352 (36-37). pp. 3849-3853. ISSN 0022-3093

Salm, C. and Hof, A.J. and Kuper, F.G. and Schmitz, J. (2006) Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs. Microelectronics Reliability, 46 (9-11). pp. 1617-1622. ISSN 0026-2714

Wali, Faisal and Knotter, D. Martin and Kelly, John J. and Kuper, Fred G. (2006) Deposition and detection of particles during integrated circuit manufacturing. In: 9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2006, 23-24 Nov 2006, Veldhoven, The Netherlands (pp. pp. 483-487).

2005

Sowariraj, M.S.B. and Jong, P.C. de and Salm, C. and Mouthaan, A.J. and Kuper, F.G. (2005) A 3-D circuit model to evaluate CDM performance of ICs. Microelectronics Reliability, 45 (9-11). pp. 1425-1429. ISSN 0026-2714

Sowariraj, M.S.B. and Jong, Peter C. de and Salm, Cora and Smedes, Theo and Mouthaan, A.J. Ton and Kuper, Fred G. (2005) Significance of Including Substrate Capacitance in the Full Chip Circuit Model of ICs under CDM Stress. In: 43th Annual International Reliability Physics Symposium, April 17-21, 2005, San Jose, CA, USA (pp. pp. 608-609).

Wang, Z. and Ackaert, J. and Scarpa, A. and Salm, C. and Kuper, F.G. and Vugts, M. (2005) Strategies to Cope with Plasma Charging Damage in Design and Layout Phases. In: International Conference on Integrated Circuit Design and Technology, ICICDT, 9-11 May 2005, Austin, Texas, USA (pp. pp. 91-98).

2004

Nguyen, H.V. and Salm, C. and Krabbenborg, B. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 April 2004, Phoenix, Arizona, USA (pp. pp. 619-620).

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. Ton and Kuper, Fred G. (2004) Fast Thermal Cycling-Enhanced Electromigration in Power Metallization. IEEE Transactions on Device and Materials Reliability, 4 (2). pp. 246-255. ISSN 1530-4388

Sowariraj, M.S.B. and Salm, Cora and Smedes, Theo and Mouthaan, A.J. Ton and Kuper, Fred G. (2004) Full chip model of CMOS Integrated Circuits under Charged Device Model stress. In: SAFE 2004, 7th Annual Workshop on Semiconductor Advances for Future Electronics, 25-26 Nov 2004, Veldhoven, the Netherlands (pp. pp. 801-807).

Tao, Guoqiao and Scarpa, Andrea and Marwijk, Leo van and Dijk, Kitty van and Kuper, Fred (2004) Applying the fWLR concept to Stress induced leakage current in non-volatile memory processes. Microelectronics Reliability, 44 (8). pp. 1269-1273. ISSN 0026-2714

Wang, Z. and Ackaert, J. and Salm, C. and Kuper, F.G. and De Backer, E. (2004) Plasma charging damage reduction in IC processing by a self-balancing interconnect. Microelectronics Reliability, 44 (9-11). pp. 1503-1507. ISSN 0026-2714

Wang, Zhichun and Ackaert, Jan and Salm, Cora and Kuper, Fred G. and Tack, Marnix and De Backer, Eddy and Coppens, Peter and De Schepper, Luc and Vlachakis, Basil (2004) Plasma-Charging Damage of Floating MIM Capacitors. IEEE Transactions on Electron Devices, 51 (6). pp. 1017-1024. ISSN 0018-9383

2003

Li, Yuan and Veenstra, Klaas Jelle and Dubois, Jerome and Peters-Wu, Lei and Zomeren, Agnes van and Kuper, Fred (2003) Reservoir effect and maximum allowed VIA misalignment for AICu interconnect with tungsten VIA plug. Microelectronics Reliability, 43 (9-11). pp. 1449-1454. ISSN 0026-2714

Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2003) Progressive degradation in a-Si: H/SiN thin film transistors. Thin Solid Films, 427 (1-2). 60-66. ISSN 0040-6090

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) A reliability model for interlayer dielectrics cracking during very fast thermal cycling. In: Advanced Metallization Conference 2003, September 29 - October 1, 2003 (Tokyo) and 21-23 October 2003 (Montreal), Tokyo, Japan and Montreal, Canada (pp. pp. 295-299).

Nguyen, H.V. and Salm, C. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2003) Electrothermomigration-induced failure in power IC metallization. In: 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands (pp. pp. 622-630).

Sowariraj, M.S.B. and Smedes, Theo and Salm, Cora and Mouthaan, Ton and Kuper, Fred G. (2003) Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels - An explantion and die protection strategy. Microelectronics Reliability, 43 (9-11). pp. 1569-1575. ISSN 0026-2714

Sowariraj, M.S.B. and Smedes, Theo and Salm, Cora and Mouthaan, Ton and Kuper, Fred G. (2003) Study on the influence of package parasitics and substrate resistance on the Charged Device Model(CDM) failure levels - possible protection methodology. In: 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands (pp. pp. 657-662).

Tao, Guoqiao and Scarpa, Andrea and Dijk, Kitty van and Kuper, Fred G. (2003) Process qualification strategy for advances embedded non volatile memory technology - the Philips'0.18um embedded flash case. In: 41st Annual International Reliability Physics Symposium, IRPS 2003, 30 March - 4 April 2003, Dallas, Texas, USA (pp. pp. 604-605).

Wang, Zhichun and Ackaert, Jan and Salm, Cora and Kuper, Fred G. and Bessemans, Klara and Backer, Eddy de (2003) Plasma charging damage induced by a power ramp down step in the end of plasma enhanced chemical vapour deposition (PECVD) process. In: 6th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2003, 25-26 November 2003, Veldhoven, The Netherlands (pp. pp. 766-770).

2002

Nguyen, H. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands (pp. pp. 69-74).

Nguyen, H. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Fast temperature cycling and electromigration induced thin film cracking multilevel interconnection: experiments and modeling. Microelectronics Reliability, 42 (9-11). pp. 1415-1420. ISSN 0026-2714

Nguyen, H. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B.H. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Test chip for detecting thin film cracking induced by fast temperature cycling and electromigration in multilevel interconnect systems. In: 9th International Symposium on Physics and Failure Analysis 2002, 8-12 Jul 2002, Singapore, Thailand (pp. pp. 135-139).

Nguyen, H. and Salm, C. and Wenzel, R. and Mouthaan, A.J. and Kuper, F.G. (2002) Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectronics Reliability, 42 (9-11). pp. 1421-1425. ISSN 0026-2714

Nguyen, H.V. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2002) Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems. In: 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 8-12 July 2002 , Singapore, Thailand (pp. pp. 135-139).

Sowariraj, M.S.B. and Kuper, F.G. and Salm, C. and Mouthaan, A.J. and Smedes, T. (2002) Impact of layout and technology variation on the CDM performance of ggNMOSTs and SCRs. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands (pp. pp. 104-107).

Sowariraj, M.S.B. and Salm, C. and Mouthaan, A.J. and Smedes, T. and Kuper, F.G. (2002) The influence of technology variation on ggNMOSTs and SCRs against CDM ESD stress. Microelectronics Reliability, 42 (9-11). pp. 1287-1292. ISSN 0026-2714

Tosic Golo, N. and Kuper, F.G. and Mouthaan, A.J. (2002) Zapping thin film transistors. Microelectronics Reliability, 42 (4). pp. 747-765. ISSN 0026-2714

Tosic Golo, Natasa and Kuper, Fred G. and Mouthaan, Ton J. (2002) Analysis of the Electrical Breakdown in Hydrogenated Amorphous Silicon Thin-Film Transistors. IEEE Transactions on Electron Devices, 49 (6). pp. 1012-1018. ISSN 0018-9383

Tosic Golo, Natasa and Wal, Siebrigje van der and Kuper, F.G. and Mouthaan, A.J. (2002) Estimation of the impact of electrostatic discharge on density of states in hydrogenated amorphous silicon thin-film transistors. Applied Physics Letters, 80 (18). pp. 3337-3339. ISSN 0003-6951

Wang, Z. and Scarpa, A. and Smits, S.M. and Kuper, F.G. and Salm, C. (2002) Temperature effect on protection diode for plasma-process induced charging damage. In: Proceedings of the 5th annual workshop on Semiconductors Advances for Future Electronics SAFE 2002, 27-28 November 2002, Veldhoven, The Netherlands (pp. pp. 127-130).

Wang, Zhichun and Scarpa, Andrea and Smits, Sander and Salm, Cora and Kuper, Fred (2002) Temperature Effect on Antenna Protection Strategy for Plasma-Process Induced Charging Damage. In: 7th International Symposium of Plasma Process-Induced Damage, June 6-7, 2002, Maui, Hawaii, USA (pp. pp. 134-137).

2001

Boselli, Gianluca and Meeuwsen, Stan and Mouthaan, Ton and Kuper, Fred (2001) Investigations on double-diffused MOS transistors under ESD zap conditions. Microelectronics Reliability, 41 (3). pp. 395-405. ISSN 0026-2714

Merticaru, A.R. and Mouthaan, A.J. and Kuper, F.G. (2001) Study of dynamics of charge trapping in a-Si:H/SiN TFTs. In: Proceedings of the 4th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2001, 29-30 Nov 2001, Veldhoven, The Netherlands (pp. pp. 109-114).

Nguyen, H.V. and Salm, C. and Vroemen, J. and Voets, J. and Krabbenborg, B. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2001) Fast thermal cycling stress and degredation in multilayer interconnects. In: 4th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE, 28-30 Nov 2001, Veldhoven, The Netherlands (pp. pp. 136-140).

Nguyen, Hieu V. and Salm, Cora and Mouthaan, Ton J. and Kuper, Fred G. (2001) Modeling of the Reservoir Effect on Electromigration Lifetime. In: 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA, July 9-13, 2001, Singapore (pp. pp. 169-173).

Salm, Cora and Houtsma, Vincent and Kuper, Fred and Woerlee, Pierre (2001) Temperature acceleration of thin gate-oxide degradation. In: 4th annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001, 28-30 Nov 2001, Veldhoven, The Netherlands (pp. pp. 174-177).

Tosic Golo, N. and Wal, S. van der and Kuper, F.G. and Mouthaan, A.J. (2001) The time-voltage trade-off for ESD damage threshold in amorphous silicon hydrogenated thin film transistors. Microelectronics Reliability, 41 (9-10). pp. 1391-1396. ISSN 0026-2714

Wang, Zhichun and Ackaert, Jan and Salm, Cora and Kuper, Fred (2001) Plasma process-induced latent damage on gate oxide-demonstrated by single-layer and multi-layer antenna structures. In: 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA, July 9-13, 2001, Singapore, Thailand (pp. pp. 220-223).

Wang, Zhichun and Ackaert, Jan and Salm, Cora and Kuper, Fred (2001) Charging induced damage on complex-antenna test structures. In: Proceedings of the 4th annual workshop on Semiconductor Advances for Future Electronics and Sensors SAFE 2001, 29-30 Nov 2001, Veldhoven, The Netherlands (pp. pp. 220-223).

Wang, Zhichun and Scarpa, Andrea and Salm, Cora and Kuper, Fred (2001) Relation between Plasma Process-Induced Oxide Failure Fraction and Antenna Ratio. In: 6th International Symposium on Plasma Process-Induced Damage, May 14-15, 2001, Monterey, CA, USA (pp. pp. 16-19).

2000

Boselli, G. and Mouthaan, A.J. and Kuper, F.G. (2000) Rise-time effects in ggnMOSt under TLP stress. In: 22nd International Conference on Microelectronics, 2000, 14-17 May, 2000, Nis, Serbia (pp. pp. 355-357).

Boselli, Gianluca and Mouthaan, Ton and Kuper, Fred (2000) Rise-time effects in ggnMOSt under TLP stress. Microelectronics Reliability, 40 (12). pp. 2061-2067. ISSN 0026-2714

Mouthaan, A.J. and Salm, C. and Lunenborg, M.M. and Wolf, M.A.R.C. de and Kuper, F.G. (2000) Dealing with hot-carrier aging in nMOS and DMOS, models, simulations and characterizations. Microelectronics Reliability, 40 (1). pp. 909-917. ISSN 0026-2714

Scarpa, Andrea and Tao, Guoqiao and Kuper, Fred G. (2000) Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry. In: 41st Annual IEEE International International Reliability Physics Symposium, IRPS 2003, 30 March - 4 April 2003, Dallas, TX, USA (pp. 602- 603).

Tosic, N. and Kuper, F.G. and Mouthaan, A.J. (2000) Degradation of -Si:H TFTs caused by electrostatic discharge. In: 22nd International Conference on Microelectronics, 2000, 14-17 May 2000 , Nis, Yugoslavia (pp. pp. 359-362).

Tosic, N. and Kuper, F.G. and Mouthaan, A.J. (2000) Transmission Line Model Testing of Top-Gate Amorphous Silicon Thin Film Transistors. In: 38th Annual IEEE International Reliability Physics Symposium, 10-13 April 2000, San Jose, CA (pp. pp. 289-294).

1999

Boselli, Gianluca and Meeuwsen, Stan and Mouthaan, Ton and Kuper, Fred (1999) Investigations on Double-Diffused MOS (DMOS) transistors under ESD zap conditions. In: Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD, 1999, 28-30 Sept. 1999, Florida, USA (pp. pp. 11-18).

1996

Meneghesso, G. and Luchies, J.R.M. and Kuper, F.G. and Mouthaan, A.J. (1996) Turn-on speed of grounded gate NMOS ESD protection transistors. Microelectronics Reliability, 36 (11/12). pp. 1735-1738. ISSN 0026-2714

Meneghesso, G. and Luchies, J.R.M. and Kuper, F.G. and Mouthaan, A.J. (1996) Turn-on speed of grounded gate NMOS ESD protection transistors. In: 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 8-11 October 1996, Enschede, The Netherlands (pp. pp. 1735-1738).

1994

Kuper, Fred and Luchies, Jan Marc and Bruines, Joop (1994) Suppression and origin of soft ESD failures in a submicron CMOS process. Journal of Electrostatics, 33 (3). pp. 313-325. ISSN 0304-3886

1993

Luchies, Jan Marc and Kuper, Fred and Verweij, Jan (1993) On the use of DC measurements for ESD-related process monitoring. Quality and Reliability Engineering International, 9 (4). pp. 309-313. ISSN 0748-8017

This list was generated on Tue Jul 22 05:35:48 2014 CEST.