Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

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Palacios-Aguilera, N.B. and Bastemeijer, J. and Mollinger, J.R. and Bossche, A. and Mokkapati, V.R.S.S. and Visser, H.A. and Akkerman, R. (2012) Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges. International journal on advances in systems and measurements, 5 (1-2). 11 - 21. ISSN 1942-261X

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Abstract:Nowadays, micro- and nanochips are usually
fabricated with Silicon and/or glass. A simple, low-cost and
reliable integration packaging method that provides flexibility
to the incorporation of electronic and fluidic devices into a
system has not been fully developed yet. The use of Printed
Circuit Board material as substrate to create dry film resist
microfluidic channels is the core technology to provide such an
integration method. The feasibility and potential of the
proposed packaging method is demonstrated in this work
Item Type:Article
Copyright:© IARIA
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Engineering Technology (CTW)
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Link to this item:http://purl.utwente.nl/publications/80964
Official URL:http://www.iariajournals.org/systems_and_measurements/index.html
Publisher URL:http://www.iariajournals.org/systems_and_measurements/index.html
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