Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

Palacios-Aguilera, N.B. and Bastemeijer, J. and Mollinger, J.R. and Bossche, A. and Mokkapati, V.R.S.S. and Visser, H.A. and Akkerman, R. (2012) Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges. International journal on advances in systems and measurements, 5 (1-2). 11 - 21. ISSN 1942-261X

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Abstract:	Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work
Item Type:	Article
Copyright:	© IARIA
Faculty:	Engineering Technology (CTW)
Research Chair:	Production Technology (PT)
Research Group:	Design, Production and Management (DPM)
Link to this item:	http://purl.utwente.nl/publications/80964
Official URL:	http://www.iariajournals.org/systems_and_measurements/index.html
Publisher URL:	http://www.iariajournals.org/systems_and_measurements/index.html
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