Nano-Link Based Ultra Low Power Micro Electronic Hotplates for Sensors and Actuators


Groenland, A.W. and Kovalgin, A.Y. and Schmitz, J. and Wolters, R.A.M. (2011) Nano-Link Based Ultra Low Power Micro Electronic Hotplates for Sensors and Actuators. ECS Transactions, 35 (30). pp. 25-34. ISSN 1938-5862

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Abstract:Ultra low-power electrical hotplates are presented based on Ohmic heating of a small conductive volume (link) sandwiched between two electrodes. The link is fabricated by etching a hole in the dielectric layer between the electrodes and subsequently filling it with TiN deposited via ALD. This results in a hollow vertical cylinder with the walls covered by a conductive (TiN) film with a thickness of 7-15 nm. Devices with micro- $(\oslash \sim2-6 \mu m)$ and nano- ($\oslash \sim100 nm)$ links were fabricated on silicon substrates and electrically characterized (I-V curves). The link temperature as a function of the applied power was estimated. Devices with a micro link reached a link temperature of ~250 ºC with a power consumption of 2.7 mW. Devices with a nanolink exhibited a link temperature of ~280 ºC by consuming only 5.5 µW.
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Additional information:Sensors, Actuators, and Microsystems (General) - 219th ECS Meeting, May 1-6, 2011 , Montreal, QC, Canada
Copyright:© 2011 The Electrochemical Society
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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