Novel cooling strategy for electronic packages: Directly injected cooling

Wits, W.W. and Vaneker, T.H.J. and Mannak, J.H. and Legtenberg, R. (2009) Novel cooling strategy for electronic packages: Directly injected cooling. CIRP Journal of Manufarcuring Science and Technology, 1 (3). pp. 142-147. ISSN 1755-5817

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Abstract:	This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and highly integrated cooling strategy for electronic packages is presented. Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support. The developed concept is a new and very cost effective concept, as fewer productions steps and fewer procured parts are required compared to traditional cooling concepts. The new concept is also easily scalable, as multiple components on an electronic product can be cooled both uniformly across the product and simultaneously. This increases design flexibility and results in electronic products with advantages in terms of performance, compactness, weight and production efficiency.
Item Type:	Article
Copyright:	© 2009 Elsevier
Faculty:	Engineering Technology (CTW)
Research Group:	Design, Production and Management (DPM)
Link to this item:	http://purl.utwente.nl/publications/79332
Official URL:	http://dx.doi.org/10.1016/j.cirpj.2008.10.001
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