The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

Kerzérho, V. and Kerkhoff, H.G. and Bollen, G.-J. and Xing, Y. (2011) The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits. In: 17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011, 16-18 May 2011, Santa Barbara, USA.

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Abstract:	This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.
Item Type:	Conference or Workshop Item
Copyright:	© 2011 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Computer Architecture for Embedded Systems (CAES)
Link to this item:	http://purl.utwente.nl/publications/79216
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