Advances in Integrated Heat Pipe Technology for Printed Circuit Boards


Wits, Wessel W. and Riele, Gert Jan te (2010) Advances in Integrated Heat Pipe Technology for Printed Circuit Boards. In: 40th International Conference on Environmental Systems, 11-15 July 2010, Barcelona.

open access
Abstract:Designing thermal control systems for electronic products has become very challenging
due to the continuous miniaturization and increasing performance demands. Two-phase
cooling solutions, such as heat pipes or vapor chambers, are increasingly used as they offer
higher thermal coefficients for heat transfer. Following a multidisciplinary and integrative
design approach, new concepts for two-phase cooling solutions for printed circuit boards are
explored. This paper shows that by integrating thermal design criteria early in the total
design phase, a radical new way of thermal control can be achieved. A new design to
integrate heat pipe technology with printed circuit board technology is presented. This
concept improves the overall design flexibility of the electronic product significantly and
thermal control is realized and manufactured in a more integrated way. Altogether this
allows engineers to design a printed circuit board with full integration of thermal control
Item Type:Conference or Workshop Item
Engineering Technology (CTW)
Research Group:
Link to this item:
Conference URL:
Export this item as:BibTeX
HTML Citation
Reference Manager


Repository Staff Only: item control page

Metis ID: 267836