Micro-assembly of three dimensional tetrahedra by capillary forces


Honschoten, J.W. van and Legrain, A. and Berenschot, J.W. and Abelmann, L. and Tas, N.R. (2011) Micro-assembly of three dimensional tetrahedra by capillary forces. In: 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, 23-27 January 2011, Cancun, Mexico (pp. pp. 288-291).

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Abstract:This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data
storage systems.
Item Type:Conference or Workshop Item
Copyright:© 2011 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/76509
Conference URL:http://www.ieee-mems2011.org/
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