Direct Electroplating on Highly Doped Patterned Silicon Wafers


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Vargas llona, L.D. and Jansen, H.V. and Elwenspoek, M.C. (2005) Direct Electroplating on Highly Doped Patterned Silicon Wafers. In: 16th MicroMechanics Europe Workshop, MME 2005, 4-6 September 2005, Göteborg, Sweden.

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Abstract:Nickel thin films have been electrodeposited directly on highly doped silicon wafers after removal of the native oxide layer. These substrates conduct sufficiently well to allow deposition using a periferical electrical contact on the wafer. Films 2 μm thick were deposited using a nickel sulfamate bath on both n+ and p+-type silicon wafers, where a series of trenches with different widths had been previously etched by plasma etching. A new, reliable and simple procedure based on the removal of the native oxide layer is presented which allows uniform plating of patterned substrates.
Item Type:Conference or Workshop Item
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/76054
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