Tailored Etch-Profiles of high aspect ratio trenches to prevent voids after refill with LPCVD sirn

Jong de, B.R. and Jansen, H.V. and Boer de, M.J. and Krijnen, G.J.M. (2005) Tailored Etch-Profiles of high aspect ratio trenches to prevent voids after refill with LPCVD sirn. In: 16th MicroMechanics Europe Workshop, MME 2005, 4-6 September 2005, Göteborg, Sweden.

Preview

PDF
2566Kb

Abstract:	A study is performed to obtain insight in etch- profile tailoring of high aspect ratio trenches (2 μm wide and 40 μm deep) to achieve void-free refilling with LPCVD SiRN. The trench profile obtained with Bosch DRIE is the most important factor determining formation of voids. Various Bosch recipes are characterized with respect to profile determining features and its applicability in void-free refilling.
Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/76008
Export this item as:	BibTeX EndNote HTML Citation Reference Manager

Show download statistics for this publication

Repository Staff Only: item control page