A single-mask thermal displacement sensor in MEMS


Share/Save/Bookmark

Hogervorst, R.P. and Krijnen, B. and Brouwer, D.M. and Engelen, J.B.C. and Staufer, U. (2010) A single-mask thermal displacement sensor in MEMS. In: Tenth International Conference of the European Society for Precision Engineering & Nanotechnology, May 31 - June 4, 2010, Delft, the Netherlands (pp. pp. 462-465).

open access
[img] PDF
1MB
Abstract:Position sensing in MEMS is often based on the principle of varying capacitance [1]. Alternative position sensing principles include using integrated optical waveguides [2] or varying thermal conductance [3]. Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a 100mm range. However a multi-mask production process and manual assembly were needed to fabricate this displacement sensor. In this work we present a 1-DOF thermal displacement sensor integrated with an actuated stage, and its experimental characterization. The system was fabricated in the device layer of a silicon-on-
insulator (SOI) wafer using a single-mask process.

Item Type:Conference or Workshop Item
Faculty:
Engineering Technology (CTW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/75551
Conference URL:http://delft2010.euspen.eu/
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page