A single-mask thermal displacement sensor in MEMS

Hogervorst, R.P. and Krijnen, B. and Brouwer, D.M. and Engelen, J.B.C. and Staufer, U. (2010) A single-mask thermal displacement sensor in MEMS. In: Tenth International Conference of the European Society for Precision Engineering & Nanotechnology, May 31 - June 4, 2010, Delft, the Netherlands.

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Abstract:	Position sensing in MEMS is often based on the principle of varying capacitance [1]. Alternative position sensing principles include using integrated optical waveguides [2] or varying thermal conductance [3]. Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a 100mm range. However a multi-mask production process and manual assembly were needed to fabricate this displacement sensor. In this work we present a 1-DOF thermal displacement sensor integrated with an actuated stage, and its experimental characterization. The system was fabricated in the device layer of a silicon-on- insulator (SOI) wafer using a single-mask process.
Item Type:	Conference or Workshop Item
Faculty:	Engineering Technology (CTW) Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Mechanical Automation and Mechatronics Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/75551
Conference URL:	http://delft2010.euspen.eu/
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