Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

Rusu, C. and Jansen, H. and Gunn, R. and Witvrouw, A. (2004) Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process. Microsystem Technologies, 10 (5). pp. 364-371. ISSN 0946-7076

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Abstract:	Many micro electromechanical systems (MEMS) require a vacuum or controlled atmosphere encapsulation in order to ensure either a good performance or an acceptable lifetime of operation. Two approaches for wafer-scale zero-level packaging exist. The most popular approach is based on wafer bonding. Alternatively, encapsulation can be done by the fabrication and sealing of perforated surface micromachined membranes. In this paper, a sealing method is proposed for zero-level packaging using a thin film reflow technique. This sealing method can be done at arbitrary ambient and pressure. Also, it is self-aligned and it can be used for sealing openings directly above the MEMS device. It thus allows for a smaller die area for the sealing ring reducing in this way the device dimensions and costs. The sealing method has been demonstrated with re-flowed aluminium, germanium, and boron phosphorous silica glass. This allows for conducting as well as non-conducting sealing layers and for a variety of allowable thermal budgets. The proposed technique is therefore very versatile.
Item Type:	Article
Copyright:	© 2004 Springer
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/75345
Official URL:	http://dx.doi.org/10.1007/s00542-004-0415-2
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