Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

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Arayanarakool, Rerngchai and Le Gac, Séverine and Berg van den, Albert (2010) Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive. Lab on a Chip, 10 (16). pp. 2115-2121. ISSN 1473-0197

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Abstract:In the fields of MicroElectroMechanical Systems (MEMS) and Lab On a Chip (LOC), a device is often fabricated using diverse substrates which are processed separately and finally assembled together using a bonding process to yield the final device. Here we describe and demonstrate a novel straightforward, rapid and low-temperature bonding technique for the assembly of complete microfluidic devices, at the chip level, by employing an intermediate layer of gluing material. This technique is applicable to a great variety of materials (e.g., glass, SU-8, parylene, UV-curable adhesive) as demonstrated here when using NOA 81 as gluing material. Bonding is firstly characterized in terms of homogeneity and thickness of the gluing layer. Following this, we verified the resistance of the adhesive layer to various organic solvents, acids, bases and conventional buffers. Finally, the assembled devices are successfully utilized for fluidic experiments.
Document Type: Article
Item Type:Article
Copyright:© 2010 The Royal Society of Chemistry
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/75042
Official URL:http://dx.doi.org/10.1039/c004436a
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