Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

Tilmans, H.A.C. and Ziad, H. and Jansen, H. and Di Monaco, O. and Jourdain, A. and De Raedt, W. and Rottenberg, X. and De Backer, E. and Decoussernaeker, A. and Baert, K. (2001) Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab. In: International Electron Devices Meeting, 2-5 Dec 2001, Washington, DC, USA.

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Abstract:	Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very small.
Item Type:	Conference or Workshop Item
Copyright:	© 2001 IEEE
Link to this item:	http://purl.utwente.nl/publications/74920
Official URL:	http://dx.doi.org/10.1109/IEDM.2001.979663
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