Effect of tensile strain on grain connectivity and flux pinning in Bi2Sr2Ca2Cu3Ox tapes

Share/Save/Bookmark

Laan, D.C. van der and Ekin, J.W. and Eck, H.J.N. van and Dhallé, M. and Haken, B. ten and Davidson, M.W. and Schwartz, J. (2006) Effect of tensile strain on grain connectivity and flux pinning in Bi2Sr2Ca2Cu3Ox tapes. Applied Physics Letters, 88 (2). 022511. ISSN 0003-6951

[img] PDF
Restricted to UT campus only
: Request a copy
118kB
Abstract:The grain-to-grain connectivity in Bi2Sr2Ca2Cu3Ox tapes is still poorly understood, even though they have been commercially available in long lengths for several years. This letter explains the effects of tensile strain on the grain-to-grain connectivity in Bi2Sr2Ca2Cu3Ox tapes. The different length scales at which damage to the grain structure occurs are studied with magneto-optical imaging, scanning-electron microscopy, and transport current. These data show that the initial degradation in critical current when strain exceeds the irreversible strain limit is caused by microcracks ( ∼ 100–500 nm in width) that form mainly at high-angle grain boundaries. Filament-wide cracks ( ∼ 5–10 μm in width) form at locations of lower grain density in the filaments at strains far exceeding the irreversible strain limit. However, in contrast to previous reports, a careful analysis of the pinning force as a function of tensile strain, taking into account current sharing with the normal matrix by using the offset criterion, shows that intragranular flux pinning is not affected by strain in any significant way.
Item Type:Article
Copyright:© 2006 American Institute of Physics
Faculty:
Science and Technology (TNW)
Research Group:
Link to this item:http://purl.utwente.nl/publications/74210
Official URL:http://dx.doi.org/10.1063/1.2165090
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 232475