Mechanical stress evolution and the blech length: 2D simulation of early electromigration effects

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Petrescu, V. and Mouthaan, A.J. and Schoenmaker, W. and Salm, C. (1998) Mechanical stress evolution and the blech length: 2D simulation of early electromigration effects. Microelectronics Reliability, 38 (6-8). pp. 1047-1050. ISSN 0026-2714

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Abstract:Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].
Item Type:Article
Copyright:© 1998 Elsevier
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/73830
Official URL:http://dx.doi.org/10.1016/S0026-2714(98)00105-X
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Metis ID: 112002