Incorporation of in-plane electrical internonnects to the reflow bonding

Mogulkoc, B. and Jansen, H.V. and Brake ter, H.J.M. and Elwenspoek, M.C. (2010) Incorporation of in-plane electrical internonnects to the reflow bonding. In: 21st Micromechanics and Micro Systems Europe Workshop, MME 2010, September 26-29, 2010, Enschede, The Netherlands.

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Abstract:	This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.
Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS) Science and Technology (TNW)
Research Group:	Transducers Science and Technology (TST) Energy, Materials and Systems (EMS)
Link to this item:	http://purl.utwente.nl/publications/73517
Conference URL:	http://www.utwente.nl/ewi/mme2010/
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