Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

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Sridhar, A. and Reiding, J. and Adelaar, H. and Achterhoek, F. and Dijk, D.J. van and Akkerman, R. (2009) Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates. Journal of Micromechanics and Microengineering, 19 (8). 085020. ISSN 0960-1317

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Abstract:In this paper, a method to fabricate radio frequency (RF) circuit structures is described. This method involves inkjet printing of a silver nanoparticle-based ink on a functional substrate material to create the seed track (i.e., the seed layer), onto which copper is subsequently deposited by an electroless plating method, to obtain the desired thickness and conductivity of the RF structures. This process combination was validated by fabricating an S-band filter on a high-frequency substrate and comparing the RF performance of this filter with that of a filter fabricated using the conventional lithography-based method. The adhesion of the circuit structures to the substrate was qualitatively ascertained by the scotch tape test method. The performance of the inkjet-printed–electroless-plated filter was comparable to that of the conventional filter, thus proving the suitability of this novel method for practical RF applications.
Item Type:Article
Copyright:© IOP Publishing
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Engineering Technology (CTW)
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Link to this item:http://purl.utwente.nl/publications/73018
Official URL:http://dx.doi.org/10.1088/0960-1317/19/8/085020
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