Transfer-Printing and Host−Guest Properties of 3D Supramolecular Particle Structures
Ling, Xing Yi (2009) Transfer-Printing and Host−Guest Properties of 3D Supramolecular Particle Structures. ACS Applied materials and interfaces, 1 (4). pp. 960-968. ISSN 1944-8244
| PDF Restricted to UT campus only: Request a copy 6Mb |
| Abstract: | Mechanically robust and crystalline supramolecular particle structures have been constructed by decoupling nanoparticle assembly and supramolecular glue infiltration into a sequential process. First, β-cyclodextrin (CD)-functionalized polystyrene particles (d 500 nm) were assembled on a CD-functionalized surface via convective assembly to form highly ordered, but mechanically unstable, particle crystals. Subsequently, the crystals were infiltrated by a solution of adamantyl-functionalized dendrimers, functioning as a supramolecular glue to bind neighboring particles together and to couple the entire particle crystal to the CD surface, both in a noncovalent manner. The supramolecular particle crystals are highly robust, as witnessed by their ability to withstand agitation by ultrasonication. When assembled on a poly(dimethylsiloxane) (PDMS) stamp, the dendrimer-infiltrated particle crystals could be transfer-printed onto a CD-functionalized target surface. By variation of the geometry and size of the PDMS stamps, single particle lines, interconnected particle rings, and V-shaped particle assemblies were obtained. The particle structures served as 3D receptors for the binding of (multiple) complementary guest molecules, indicating that the supramolecular host functionalities of the particle crystals were retained throughout the fabrication process. |
| Item Type: | Article |
| Copyright: | © 2009 American Chemical Society |
| Research Group: | |
| Link to this item: | http://purl.utwente.nl/publications/72082 |
| Official URL: | http://dx.doi.org/10.1021/am900071y |
| Export this item as: | BibTeX EndNote HTML Citation Reference Manager |
Repository Staff Only: item control page
Metis ID: 259839

Show download statistics for this publication
Show download statistics for this publication