A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors


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Aarnink, A.A.I. and Boogaard, A. and Brunets, I. and Isai, I.G. and Kovalgin, A.Y. and Holleman, J. and Wolters, R.A.M. and Schmitz, J. (2005) A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. In: 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005 (SAFE 2005), 17-18 November 2005, Veldhoven, the Netherlands.

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Abstract:We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150
Item Type:Conference or Workshop Item
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/67714
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