A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

Aarnink, A.A.I. and Boogaard, A. and Brunets, I. and Isai, I.G. and Kovalgin, A.Y. and Holleman, J. and Wolters, R.A.M. and Schmitz, J. (2005) A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. In: 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005 (SAFE 2005), 17-18 November 2005, Veldhoven, the Netherlands.

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Abstract:	We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150
Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Semiconductor Components (SC)
Link to this item:	http://purl.utwente.nl/publications/67714
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