Wafer scale nano-membranes supported on a silicon microsieve


Unnikrishnan, S. and Jansen, H.V. and Berenschot, J.W. and Elwenspoek, M.C. (2007) Wafer scale nano-membranes supported on a silicon microsieve. In: Micromechanics Europe 2007, 16-18 September 2007, Portugal (pp. pp. 127-130).

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Abstract:A new micromachining method to fabricate
wafer scale, atomically smooth nano-membranes is
described. The delicate membrane is supported on a robust
silicon microsieve fabricated by plasma etching. The
supporting sieve is micromachined independently of the
nano-membrane, which is later fusion bonded to it. The
transferred thin-film membrane can be dense, porous or
perforated according to the application desired. One of the
main application areas for such membranes is in fluidics,
where the small thickness and high strength of the supported
nano-membranes is a big advantage. The novel method
described enables to easily up-scale and interface micro or
nano-membranes to the macro-world
Item Type:Conference or Workshop Item
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/65248
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