Fusion-bonded fluidic interconnects

Fazal, I. and Elwenspoek, M.C. (2008) Fusion-bonded fluidic interconnects. Journal of micromechanics and microengineering, 18 (5). 055011. ISSN 0960-1317

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Abstract:	A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 νm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C.
Item Type:	Article
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/65152
Official URL:	http://dx.doi.org/10.1088/0960-1317/18/5/055011
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