Micromachining of \lbrace111\rbrace plates in <001> oriented silicon


Berenschot, J.W. and Oosterbroek, R.E. and Lammerink, T.S.J. and Elwenspoek, M.C. (1998) Micromachining of \lbrace111\rbrace plates in <001> oriented silicon. Journal of Micromechanics and Microengineering, 8 (2). pp. 104-107. ISSN 0960-1317

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Abstract:We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
Item Type:Article
Additional information:Paper from the 8th Workshop on Micromachining, Micromechanics and Microsystems (MME'97) held at the Southampton University in Great Britain between 31 August and 2 September 1997
Copyright:© 1998 IOP Publishing
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/64952
Official URL:https://doi.org/10.1088/0960-1317/8/2/015
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