Micromachining of $\lbrace$ 111 $\rbrace$ plates in <001> oriented silicon

Berenschot, J.W. and Oosterbroek, R.E. and Lammerink, T.S.J. and Elwenspoek, M.C. (1998) Micromachining of $\lbrace$ 111 $\rbrace$ plates in <001> oriented silicon. Journal of Micromechanics and Microengineering, 8 (2). pp. 104-107. ISSN 0960-1317

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Abstract:	We introduce a new way to micromachine $\lbrace$ 111 $\rbrace$ oriented plates on $\lbrace$ 001 $\rbrace$ silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
Item Type:	Article
Copyright:	© 1998 IOP Publishing
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/64952
Official URL:	http://dx.doi.org/10.1088/0960-1317/8/2/015
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Micromachining of 111 plates in <001> oriented silicon