Thermal design issues and performance of microcalorimeter arrays at sub-Kelvin temperatures


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Ridder, M.L. and Bruijn, M.P. and Hoevers, H.F.C. and Germeau, A. and Baars, N.H.R. and Krouwer, E. and Baar, J.J.J. van and Wiegerink, R.J. (2003) Thermal design issues and performance of microcalorimeter arrays at sub-Kelvin temperatures. In: IEEE Sensors 2003 Conference, 22-24 October 2003, Toronto, Canada (pp. pp. 353-357).

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Abstract:We have produced 5/spl times/5 pixel arrays of microcalorimeters using bulk micromachining. Analysis of our data provides the thermal conductivity parameters of Si/sub x/N/sub y/ 1 /spl mu/m thick membranes at 100 mK. Moreover we find that the thermal transport at 100 mK in Si beams, with dimensions 1.25 mm /spl times/ 0.35mm /spl times/ 35/spl mu/m (length /spl times/ height /spl times/ width) is dominated by ballistic phonons with a mean free path of 110 /spl mu/m. These thermal parameters can be used for modelling future 32 /spl times/ 32 pixel arrays. In addition we operated three pixels in a 5 /spl times/ 5 array of microcalorimeters and find that the pixel to pixel reproducibility is very good. When used as an X-ray microcalorimeter individual pixels have a thermal decay time of 200 /spl mu/s is and their energy resolution is between 6 and 7 eV for 5.89 keV X-ray photons.
Item Type:Conference or Workshop Item
Copyright:© 2003 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/64728
Official URL:http://dx.doi.org/10.1109/ICSENS.2003.1278957
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