Deposition and detection of particles during integrated circuit manufacturing


Wali, Faisal and Knotter, D. Martin and Kelly, John J. and Kuper, Fred G. (2006) Deposition and detection of particles during integrated circuit manufacturing. In: 9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2006, 23-24 Nov 2006, Veldhoven, The Netherlands (pp. pp. 483-487).

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Abstract:Abstract—Deposition mechanism of silica particles on silicon wafers was investigated by depositing specially prepared mono-dispersed particles (mean diameter = 330 nm). To measure particles of the size below the detection limit of our particle measurement tools, silica particles with luminance core were prepared. Three phenomena of deposition were discerned: sedimentation (diffusion driven), printing due to hydrodynamic forces at gas-solid-liquid interface, and dry in of carry-over layer.
Item Type:Conference or Workshop Item
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Metis ID: 237713