Deposition and detection of particles during integrated circuit manufacturing


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Wali, Faisal and Knotter, D. Martin and Kelly, John J. and Kuper, Fred G. (2006) Deposition and detection of particles during integrated circuit manufacturing. In: 9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2006, 23-24 Nov 2006, Veldhoven, The Netherlands.

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Abstract:Abstract—Deposition mechanism of silica particles on silicon wafers was investigated by depositing specially prepared mono-dispersed particles (mean diameter = 330 nm). To measure particles of the size below the detection limit of our particle measurement tools, silica particles with luminance core were prepared. Three phenomena of deposition were discerned: sedimentation (diffusion driven), printing due to hydrodynamic forces at gas-solid-liquid interface, and dry in of carry-over layer.
Item Type:Conference or Workshop Item
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/63765
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