Stability of thin platinum films implemented in high-temperature microdevices

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Tiggelaar, R.M. and Sanders, R.G.P. and Groenland, A.W. and Gardeniers, J.G.E. (2009) Stability of thin platinum films implemented in high-temperature microdevices. Sensors and Actuators A: Physical, 152 (1). pp. 39-47. ISSN 0924-4247

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Abstract:In this paper we report on structural and electrical properties of thin films of Pt with Ti, Ta, or no adhesion, which were annealed in different ambient at temperatures in the range 400–950 ◦C. Correlations are made between the mechanical strain and grain size values obtained from X-ray diffraction, electrical measurements, and optical microscope images of film sintering after annealing at high temperature. A method to obtain highly adhesive, patterned Pt films without adhesion layer is presented, which films show the highest reliability, in terms of structural integrity and electrical properties. Therefore this is the best option for implementation in high-temperature microdevices like microreactors and gas sensors operating at temperatures above 750 ◦C.
Item Type:Article
Copyright:© 2009 Elsevier Science
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/62804
Official URL:http://dx.doi.org/10.1016/j.sna.2009.03.017
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