Local distribution of particles deposited on patterned surfaces

Share/Save/Bookmark

Wali, Faisal and Knotter, D. Martin and Bearda, Twan and Mertens, Paul W. (2009) Local distribution of particles deposited on patterned surfaces. Solid State Phenomena, 145-14 . pp. 65-68. ISSN 1012-0394

[img]PDF
Restricted to UT campus only
: Request a copy
796Kb
Abstract:In many process steps of integrated circuits (IC’s) fabrication, silicon wafers are coming in contact with process liquids such as ultra pure water (UPW) and aqueous and non-aqueous chemical mixtures. During these process steps, liquid-borne particle contamination can deposit on the wafer surface. Particle contamination from UPW is an important factor influencing random yield loss of IC’s [1]. A number of yield models are used to predict yields including Poisson, Murphy, Seeds, and negative binomial models [2,3]. However, these models are based on the assumption that particles are randomly deposited on the wafer surface [4].
Item Type:Article
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/62726
Official URL:http://dx.doi.org/10.4028/www.scientific.net/SSP.145-146.65
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 263729