Wafer scale nano-membrane supported on a silicon microsieve using thin-film transfer technology

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Unnikrishnan, S. and Jansen, H.V. and Berenschot, J.W. and Elwenspoek, M.C. (2008) Wafer scale nano-membrane supported on a silicon microsieve using thin-film transfer technology. Journal of micromechanics and microengineering, 18 (6). 064005. ISSN 0960-1317

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Abstract:A new micromachining method to fabricate wafer scale nano-membranes is described. The delicate
thin-film nano-membrane is supported on a robust silicon microsieve fabricated by plasma etching.
The silicon sieve is micromachined independently of the thin-film, which is later transferred onto it
by fusion bonding, thus providing flexibility in design and processing steps. Using this thin-film transfer
technique, nano-membranes down to 50nm thickness are fabricated. The fabrication of different kinds of
membranes made of inorganic, metallic and polymer materials is presented here. Apart from dense nanomembranes,
perforated membranes are fabricated using this modular approach. One of the main areas of
interest for such membranes is in fluidics, where the small thickness and high strength of the supported
nano-membranes is a big advantage
Item Type:Article
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/62639
Official URL:http://dx.doi.org/10.1088/0960-1317/18/6/064005
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