Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

Klee, M. and Beelen, D. and Keurl, W. and Kiewitt, R. and Kumar, B. and Mauczok, R. and Reimann, K. and Renders, Ch. and Roest, A. and Roozeboom, F. and Steeneken, P.G. and Tiggelman, M.P.J. and Vanhelmont, F. and Wunnicke, O. and Lok, P. and Neumann, K. and Fraser, J. and Schmitz, G. (2007) Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. In: 15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006, 30 July - 3 August 2006, Sunset Beach, NC, USA.

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Abstract:	Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.
Item Type:	Conference or Workshop Item
Copyright:	© 2007 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Semiconductor Components (SC)
Link to this item:	http://purl.utwente.nl/publications/62169
Official URL:	http://dx.doi.org/10.1109/ISAF.2006.4387821
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