Technological aspects of gaseous pixel detectors fabrication


Blanco Carballo, V.M. and Salm, C. and Smits, S.M. and Schmitz, J. and Melai, J. and Chefdeville, M. and Graaf, H. van der (2007) Technological aspects of gaseous pixel detectors fabrication. In: 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE), 29-30 Nov. 2007, Veldhoven, The Netherlands (pp. pp. 501-503).

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Abstract:Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated.
SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress problems. In this paper we describe the several methods we have investigated to fabricate a metal layer on top of a partially crosslinked SU-8 film and the challenges we have encountered.
The fabrication process using wafer post processing has been proven, but in cases where single chip processing is desirable, edge bead is a major problem to overcome as it can cover a considerable chip area, reducing the detector performance; we show different techniques to reduce this edge bead and improve detection efficiency.
Item Type:Conference or Workshop Item
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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