Seedless electroplating on patterned silicon

Share/Save/Bookmark

Vargas llona, L.D. and Jansen, H.V. and Elwenspoek, M.C. (2006) Seedless electroplating on patterned silicon. Journal of Micromechanics and Microengineering, 16 (6). pp. 1-6. ISSN 0960-1317

open access
[img]
Preview
PDF
776kB
Abstract:Nickel thin films have been electrodeposited without the use of an additional
seed layer, on highly doped silicon wafers. These substrates conduct
sufficiently well to allow deposition using a peripherical electrical contact on
the wafer. Films 2 μm thick have been deposited using a nickel sulfamate
bath on both n+- and p+-type silicon wafers, where a series of trenches with
different widths had been previously etched by plasma etching. A new,
reliable and simple procedure based on the removal of the native oxide layer
is presented which allows uniform plating of patterned substrates.
Item Type:Article
Additional information:16th European Workshop on Micromechanics (MME 2005)
Copyright:© Institute of Physics
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/59592
Official URL:http://dx.doi.org/10.1088/0960-1317/16/6/S01
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 248480