Seedless electroplating on patterned silicon

Vargas llona, L.D. and Jansen, H.V. and Elwenspoek, M.C. (2006) Seedless electroplating on patterned silicon. Journal of Micromechanics and Microengineering, 16 (6). pp. 1-6. ISSN 0960-1317

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Abstract:	Nickel thin films have been electrodeposited without the use of an additional seed layer, on highly doped silicon wafers. These substrates conduct sufficiently well to allow deposition using a peripherical electrical contact on the wafer. Films 2 μm thick have been deposited using a nickel sulfamate bath on both n+- and p+-type silicon wafers, where a series of trenches with different widths had been previously etched by plasma etching. A new, reliable and simple procedure based on the removal of the native oxide layer is presented which allows uniform plating of patterned substrates.
Item Type:	Article
Copyright:	© Institute of Physics
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/59592
Official URL:	http://dx.doi.org/10.1088/0960-1317/16/6/S01
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