Microcontact printing and pattern transfer with a tri-layer processing


Chen, Y. and Lebib, A. and Carcenac, F. and Launois, H. and Schmidt, G. and Tormen, M. and Muller, G. and Molenkamp, L.W. and Liebau, M. and Huskens, J. and Reinhoudt, D.N. (2000) Microcontact printing and pattern transfer with a tri-layer processing. Microelectronic Engineering, 53 (1-4). pp. 253-256. ISSN 0167-9317

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Abstract:We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps
Item Type:Article
Copyright: © 2000 Elsevier
Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/59463
Official URL:https://doi.org/10.1016/S0167-9317(00)00309-9
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