Microcontact printing and pattern transfer with a tri-layer processing

Chen, Y. and Lebib, A. and Carcenac, F. and Launois, H. and Schmidt, G. and Tormen, M. and Muller, G. and Molenkamp, L.W. and Liebau, M. and Huskens, J. and Reinhoudt, D.N. (2000) Microcontact printing and pattern transfer with a tri-layer processing. Microelectronic Engineering, 53 (1-4). pp. 253-256. ISSN 0167-9317

PDF
Restricted to UT campus only: Request a copy
953Kb

Abstract:	We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps
Item Type:	Article
Copyright:	© 2000 Elsevier
Faculty:	Science and Technology (TNW)
Research Group:	Molecular Nanofabrication (MNF)
Link to this item:	http://purl.utwente.nl/publications/59463
Official URL:	http://dx.doi.org/10.1016/S0167-9317(00)00309-9
Export this item as:	BibTeX EndNote HTML Citation Reference Manager

Show download statistics for this publication

Repository Staff Only: item control page