A test chip for automatic reliability measurements of interconnect vias

Lippe, K. and Hasper, A. and Elfrink, G.W. and Niehof, J. and Kerkhoff, H.G. (1992) A test chip for automatic reliability measurements of interconnect vias. In: 30th Annual International Reliability Physics Symposium, 31 March-2 April 1992 , San Diego, CA.

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Abstract:	A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.
Item Type:	Conference or Workshop Item
Copyright:	© 1992 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Computer Architecture for Embedded Systems (CAES)
Link to this item:	http://purl.utwente.nl/publications/58965
Official URL:	http://dx.doi.org/10.1109/RELPHY.1992.187653
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