The use of silicon technology for an electret microphone construction


Sprenkels, A.J. and Bergveld, P. (1988) The use of silicon technology for an electret microphone construction. In: 6th International Symposium on Electrets, ISE, September 1-3, 1988, Oxford, England (pp. pp. 593-597).

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Abstract:The authors present a subminiature electret microphone which has been realized in silicon using wafer processing techniques. The microphone consists of two conducting plates which form a capacitor. The lower plate (backplate) is rigid and fabricated in silicon. The upper plate (diaphragm) consists of a 6-¿m-thick metallized Mylar foil. In the air cavity between both plates a 1-¿m-thick silicon dioxide electret is present. The fabrication process, such as the construction of the silicon backplate, the realization of the electret, and the diaphragm attachment, are described. The microphones measure 3-mm×3-mm×3-mm and show a sensitivity of 1.4 mV/¿bar and a frequency response within ±1 dB up to 15 kHz
Item Type:Conference or Workshop Item
Copyright:©1988 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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