Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

Share/Save/Bookmark

Gui, C. and Elwenspoek, M. and Gardeniers, J.G.E. and Lambeck, P.V. (1998) Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding. Journal of the Electrochemical Society, 145 (6). pp. 2198-2204. ISSN 0013-4651

[img] PDF
Restricted to UT campus only
: Request a copy
2MB
Abstract:Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.
Item Type:Article
Copyright:©1998 The Electrochemical Society, Inc.
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Science and Technology (TNW)
Research Group:
Link to this item:http://purl.utwente.nl/publications/55977
Official URL:http://dx.doi.org/10.1149/1.1838616
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page