Novel thin film polymer foaming technique for low and ultra low-k dielectrics

Krause, B. and Koops, G.H. and Vegt van der, N.F.A. and Wessling, M. and Wubbenhorst, M. and Turnhout van, J. (2001) Novel thin film polymer foaming technique for low and ultra low-k dielectrics. In: 7th IEEE International Conference on Solid Dielectrics, ICSD, 25-29 June 2001, Eindhoven, The Netherlands.

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Abstract:	The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Item Type:	Conference or Workshop Item
Copyright:	©2001 IEEE
Faculty:	Science and Technology (TNW)
Research Group:	Membrane Science and Technology (MST)
Link to this item:	http://purl.utwente.nl/publications/55919
Official URL:	http://dx.doi.org/10.1109/ICSD.2001.955585
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