Novel thin film polymer foaming technique for low and ultra low-k dielectrics


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Krause, B. and Koops, G.H. and Vegt, N.F.A. van der and Wessling, M. and Wubbenhorst, M. and Turnhout, J. van (2001) Novel thin film polymer foaming technique for low and ultra low-k dielectrics. In: 7th IEEE International Conference on Solid Dielectrics, ICSD, 25-29 June 2001, Eindhoven, The Netherlands (pp. pp. 187-190).

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Abstract:The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Item Type:Conference or Workshop Item
Copyright:©2001 IEEE
Faculty:
Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/55919
Official URL:http://dx.doi.org/10.1109/ICSD.2001.955585
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