"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS


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Kim, B.J. and Kim, G.M. and Liebau, M. and Huskens, J. and Reinhoudt, D.N. and Brugger, J. (2001) "SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS. In: 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001, 21-25 January 2001, Interlaken, Switzerland.

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Abstract:In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps
Item Type:Conference or Workshop Item
Copyright:© 2001 IEEE
Faculty:
Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/55916
Official URL:http://dx.doi.org/10.1109/MEMSYS.2001.906490
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