Fabrication of silicon condenser microphones using single wafer technology


Scheeper, P.R. and Donk, A.G.H. van der and Olthuis, W. and Bergveld, P. (1992) Fabrication of silicon condenser microphones using single wafer technology. Journal of Microelectromechanical Systems, 1 (3). pp. 147-154. ISSN 1057-7157

open access
Abstract:A condenser microphone design that can be fabricated using the sacrificial layer technique is proposed and tested. The microphone backplate is a 1-¿m plasma-enhanced chemical-vapor-deposited (PECVD) silicon nitride film with a high density of acoustic holes (120-525 holes/mm2), covered with a thin Ti/Au electrode. Microphones with a flat frequency response between 100 Hz and 14 kHz and a sensitivity of typically 1-2 mV/Pa have been fabricated in a reproducible way. These sensitivities can be achieved using a relatively low bias voltage of 6-16 V. The measured sensitivities and bandwidths are comparable to those of other silicon microphones with highly perforated backplates. The major advantage of the new microphone design is that it can be fabricated on a single wafer so that no bonding techniques are required
Item Type:Article
Copyright:©1992 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/55723
Official URL:https://doi.org/10.1109/84.186394
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