Bond Strength Tests Between Silicon Wafers and Duran Tubes (Fusion Bonded Fluidic Interconnects)

Fazal, I. and Berenschot, J.W. and Boer de, J.H. and Jansen, H.V. and Elwenspoek, M.C. (2005) Bond Strength Tests Between Silicon Wafers and Duran Tubes (Fusion Bonded Fluidic Interconnects). In: The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

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Abstract:	The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.
Item Type:	Conference or Workshop Item
Copyright:	©2005 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/52563
Official URL:	http://dx.doi.org/10.1109/SENSOR.2005.1496572
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