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Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties
Bystrova, Svetlana (2004) Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties. thesis.
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| Abstract: | This thesis presents results of a study focused on the growth processes of tungsten nitride silicide films by CVD; tungsten nitride and tungsten carbidonitride films by ALD |
| Item Type: | Thesis |
| Faculty: | Science and Technology (TNW) |
| Research Group: | |
| Link to this item: | http://purl.utwente.nl/publications/48234 |
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Metis ID: 219064