Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties


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Bystrova, Svetlana (2004) Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties. thesis.

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Abstract:This thesis presents results of a study focused on the growth processes of tungsten nitride silicide films by CVD; tungsten nitride and tungsten carbidonitride films by ALD
Item Type:Thesis
Faculty:
Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/48234
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Metis ID: 219064