Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding

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Hermes, D.C. and Heuser, T. and Wouden van der, E.J. and Gardeniers, J.G.E. and Berg van den, A. (2004) Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding. In: First Mikropruf Workshop on Wafer Bonding for MEMS Technologies, 11-12 October 2004, Saale, Germany.

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Item Type:Conference or Workshop Item
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
Science and Technology (TNW)
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