Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding

Hermes, D.C. and Heuser, T. and Wouden van der, E.J. and Gardeniers, J.G.E. and Berg van den, A. (2004) Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding. In: First Mikropruf Workshop on Wafer Bonding for MEMS Technologies, 11-12 October 2004, Saale, Germany.

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Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS) Science and Technology (TNW)
Research Group:	Biomedical and Environmental Sensor systems (BIOS) Mesoscale Chemical Systems (MCS)
Link to this item:	http://purl.utwente.nl/publications/47846
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