Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics


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Nguyen, H.V. and Salm, C. and Krabbenborg, B. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 April 2004, Phoenix, Arizona, USA.

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Abstract:The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
Item Type:Conference or Workshop Item
Copyright:© 2004 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/47484
Official URL:http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1315418
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