Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics

Nguyen, H.V. and Salm, C. and Krabbenborg, B. and Weide-Zaage, K. and Bisschop, J. and Mouthaan, A.J. and Kuper, F.G. (2004) Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics. In: IEEE 42nd Annual International Reliability Physics Symposium, 25-29 April 2004, Phoenix, Arizona, USA.

Preview

PDF
163Kb

Abstract:	The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
Item Type:	Conference or Workshop Item
Copyright:	© 2004 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Semiconductor Components (SC)
Link to this item:	http://purl.utwente.nl/publications/47484
Official URL:	http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1315418
Export this item as:	BibTeX EndNote HTML Citation Reference Manager

Show download statistics for this publication

Repository Staff Only: item control page

Metis ID: 218016