The Detection of Defects in a Niobium Tri-layer Process

Share/Save/Bookmark

Joseph, Arun A. and Heuvelmans, Sander and Gerritsma, Gerrit J. and Kerkhoff, Hans G. (2003) The Detection of Defects in a Niobium Tri-layer Process. IEEE Transactions on Applied Superconductivity, 13 (2). pp. 95-98. ISSN 1051-8223

[img]
Preview
PDF
1533Kb
Abstract:Niobium (Nb) LTS processes are emerging as the technology for future ultra high-speed systems especially in the digital domain. As the number of Josephson Junctions (JJ) per chip has recently increased to around 90000, the quality of the process has to be assured so as to realize these complex circuits. Until now, very little or no information is available in the literature on how to achieve this. In this paper we present an approach and results of a study conducted on an RSFQ process. Measurements and SEM inspection were carried out on sample chips and a list of possible defects has been identified and described in detail. We have also developed test-structures for detection of the top-ranking defects, which will be used for yield analysis and the determination of the probability distribution of faults in the process. A test chip has been designed, based on the results of this study, and certain types of defects were introduced in the design to study the behavior of faulty junctions and interconnections.
Item Type:Article
Copyright:©2003 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/43945
Official URL:http://dx.doi.org/10.1109/TASC.2003.813654
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 207854