Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

Timmer, B.H. and Delft van, K.M. and Dermendjieva-Jansink, T.D. and Olthuis, W. and Bergveld, Piet and Berg van den, A. (2002) Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In: Workshop MicroMechanics Europe, MME, 6-12 October 2002, Sinaia, Romania.

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Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Biomedical and Environmental Sensor systems (BIOS)
Link to this item:	http://purl.utwente.nl/publications/43786
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