Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass


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Timmer, B.H. and Delft, K.M. van and Dermendjieva-Jansink, T.D. and Olthuis, W. and Bergveld, Piet and Berg, A. van den (2002) Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In: Workshop MicroMechanics Europe, MME, 6-12 October 2002, Sinaia, Romania (pp. pp. 339-341).

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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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