Temperature Effect on Antenna Protection Strategy for Plasma-Process Induced Charging Damage

Wang, Zhichun and Scarpa, Andrea and Smits, Sander and Salm, Cora and Kuper, Fred (2002) Temperature Effect on Antenna Protection Strategy for Plasma-Process Induced Charging Damage. In: 7th International Symposium of Plasma Process-Induced Damage, June 6-7, 2002, Maui, Hawaii, USA.

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Abstract:	The leakage current of different drain-well diodes for plasma-charging protection has been simulated at high temperature. The simulation shows that the high ambient temperature, especially during plasma deposition process, enormously enhances the efficacy of the protection diodes in protecting thin oxide. The efficacy of different diodes has been compared by simulation and experiment. Based on our discoveries, a strategic protection scheme for plasma-process induced damage (PPID) is proposed.
Item Type:	Conference or Workshop Item
Copyright:	© 2002 American Vacuum Society
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Semiconductor Components (SC)
Link to this item:	http://purl.utwente.nl/publications/43321
Official URL:	http://dx.doi.org/10.1109/PPID.2002.1042627
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