Fabrication and packaging of a miniature sensor array for harsh environments

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Dijkstra, E.A. and Olthuis, W. and Bomer, J.G. and Kronemeijer, D.A. and Bergveld, P. (2001) Fabrication and packaging of a miniature sensor array for harsh environments. In: Microelectromechanical Systems Conference, 2001, August 24-26, 2001, Berkeley, CA, USA (pp. pp. 14-17).

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Abstract:This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
Item Type:Conference or Workshop Item
Copyright:©2001 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/42170
Official URL:http://dx.doi.org/10.1109/MEMSC.2001.992731
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Metis ID: 200642