Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

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Blom, M.T. and Chmela, E. and Gardeniers, J.G.E. and Berenschot, J.W. and Elwenspoek, M. and Tijssen, R. and Berg, A. van den (2001) Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections. Journal of Micromechanics and Microengineering, 11 (4). pp. 382-385. ISSN 0960-1317

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Abstract:Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
Item Type:Article
Copyright:© Institute of Physics and IOP Publishing Limited 2001
Faculty:
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/42032
Official URL:http://dx.doi.org/10.1088/0960-1317/11/4/317
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