Low-temperature glass bonding for sensor applications

Legtenberg, R. and Bouwstra, S. and Elwenspoek, M.C. (1990) Low-temperature glass bonding for sensor applications. In: Micro Mechanics Europe Conference, MME, November 26-27, 1990, Berlin, Germany.

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Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/25498
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Metis ID: 130300