Low-temperature glass bonding for sensor applications

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Legtenberg, R. and Bouwstra, S. and Elwenspoek, M.C. (1990) Low-temperature glass bonding for sensor applications. In: Micro Mechanics Europe Conference, MME, November 26-27, 1990, Berlin, Germany (pp. pp. 87-92).

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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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